Features
■A vacuum laminator for wafers of 300mm.(optionally available:8inches) | ■Single and double cassette loading | ■Two cutting methods (including V-notch cutting):digital cutter blade method,Pre-Cur method | ■All parameters important for taping can be controlled in the recipe. Equipment can be configured with ultimate vacuum at 100Pa. |
■Can be used with thinner wafers.(such as shaped or reworked wafers) | ■Other optional features are available. |
Specifications
Power | AC200-240V,Single Phase |
---|---|
Power Consumption | 3KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
Dimension(WxDxHmm) | 1450×2000×2400 |
---|---|
Net Weight | Appx 1400Kg |
Features
■A tape laminator for wafers up to 300mm(optionally available:8inches) | ■Single and double cassette loading | ■Two cutting methods (V-notch cutting):digital cutter blade method and class 4 CO2 laser method. | ■All parameters important for taping can be controlled in the recipe. | ■Can be used with thinner wafers.(such as shaped or reworked wafers) | ■Other optional features are available. |
Specifications
Power | AC200-240V,Single Phase |
---|---|
Power Consumption | 3KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
Dimension(WxDxHmm) | 1350×1750×2100 |
---|---|
Net Weight | Appx 1200Kg |
Features
■A tape laminator for wafers up to 200mm(8inches)(4-,5-,6-,and 8-inch) | ■Two cutting methods (V-notch cutting):digital cutter blade method and class 4 CO2 laser method | ■All parameters important for taping can be controlled in the recipe. | ■Can be used with thinner wafers.(such as shaped or reworked wafers) | ■Other optional features are available. |
Specifications
Power | AC200-240V,Single Phase |
---|---|
Power Consumption | 3KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
Dimension(WxDxHmm) | 1250×1390×1850 |
---|---|
Net Weight | Appx 500Kg |
Features
■Fully Automatic Laminator for Panel Size (Applicable Panel size, please contact to Teikoku Taping System) | ■Cutting by TTS Digital Cutter Blade will follow exact panel size. | ■Applicable for TTS Inline Pre-Cut Tape Lamination | ■Other optional features are available (Tape Remove Function、Inline LED UV Irradiation、Vacuum Lamination etc..) |
Specifications
Power | AC200-240V,Single Phase |
---|---|
Power Consumption | 3KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
Dimension(WxDxHmm) | 1800×1200×1900 |
---|---|
Net Weight | Appx 1200Kg |