Features
| ■A wafer tape mounter for wafers of 300mm.(optionally available:8inches) | ■All parameters important for attaching a wafer onto a frame can be controlled in the recipe. | ■Can be used with ultra-thin wafers.(such as shaped or reworked wafers) | ■Inline UV irradiation and BG de-taping features available.(options) | ■Longer-lasting UV lamp realized by TTS’s proprietary UV technology | ■Other optional features are available |
Specifications
| Power | AC200-240V,Single Phase |
|---|---|
| Power Consumption | 2KVA[Without UV] 3KVA[With UV] |
| Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
| Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
| Nitrogen(For UV) | 0.2 – 0.4 MPa ( Min Flow Rate:20NL/min) |
| Exhaust Duct Capacity | 1.0m3/min,10mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension(WxDxHmm) | 1900×2500×1900 |
|---|---|
| Net Weight | Appx 1800Kg |
Features
| ■A Wafer Mounter is able to handle for up to 12inch Wafer Size. (Applicable 4,5,6 and 8 inch Wafer Size) | ■Applicable to handle for Ultra Thin Wafer and Fragile Wafer like a Compound Semiconductor. | ■Applicable for both Roll Cut Dicing Tape and Pre-cut Dicing Tape | ■Other optional features are available (Barcode Printer/Reader、OCR、Apply for PCB/Panel Size etc..) |
Specifications
| Power | AC200-240V,Single Phase |
|---|---|
| Power Consumption | 3KVA |
| Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
| Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
System Arrangement
| Dimension(WxDxHmm) | 1860×1860×1900 |
|---|---|
| Net Weight | Appx 1200Kg |
